Unimicron Technology Corporation
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PCB

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HDI

Production Information

Features

  • Suitable for BGA with smaller ball pitch and higher I/O counts
  • Fine line, micro via and registration technologies capable of 0.3 mm ball pitch, Increase routing density in complicated design
  • Thin board capabilities, copper filled via and excellent mounting stability and reliability
  • Lower Dk / Df material enables better signal transmission performance
  • Low CTE & High Tg material fulfills high reliability demand
  • Qualified material and surface treatment for Lead-free process

Benefits

  • World’s largest HDI manufacturer
  • Over 10 years’ experience in HDI manufacturing
  • Well experienced manufacturer with good yield
  • From both China and Taiwan, multiple plants increase production output in short time

Applications

  • Smartphone, Feature Phone, Tablet, Ultrabook
  • e-Reader, MP3 Player, GPS, Portable Game Console
  • DSC, Camcorder, LCD Module
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© Unimicron Corporation All Rights Reserved |  Last update : 2020.03.13
© Unimicron Corporation All Rights Reserved
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